Process Engineer
CV-LibrarySedgefield, County DurhampermanentPosted: 7 April 2026
Apply NowBaltic Recruitment are delighted to be partnering with an established, innovative, and rapidly expanding market leader with their search for an experienced Process Engineer. This is a fantastic opportunity to join a forward-thinking organisation at the forefront of its industry, playing a key role in driving operational excellence, continuous improvement, and manufacturing innovation during an exciting period of sustained growth.
This position demands expertise in semiconductor packaging and module assembly, alongside the ability to implement and optimise scalable manufacturing systems that support a smooth progression from technology development and New Product Introduction (NPI) through to high-reliability, volume production.
Overall Purpose:
Own packaging process architecture across the full product lifecycle.
Advise leadership on packaging technology direction and capital strategy.
Lead hands-on process optimisation and problem-solving activities on the production floor.
Build scalable systems capable of supporting defence and telecom growth programmes. Key Duties:
Packaging System Architecture & Strategy.
Define and implement a structured, end-to-end packaging and assembly system aligned with our RF product roadmap.
Establish standardised process flows covering.
Die preparation: Die attach, Wire bonding, Plastic encapsulation/moulding, Dicing/singulation, QFN assembly, Inspection, reliability and SMT integration.
Technology & Concept Phase (Pre-NPI Influence).
NPI & Process Architecture Development.
Lifecycle Ownership - Concept to Volume.
Hands-on Technical Leadership.
RF & High-Frequency Packaging Integration.
Equipment, Capital & Supplier Strategy.
Governance, Compliance & Reliability.Key Requirements:
University Degree in Materials Science, Mechanical Engineering, Electronics Engineering, or related discipline, or relevant experience in semiconductor packaging and assembly processes including: QFN, Plastic encapsulation and moulding, Dicing and singulation, Die attach and wire bonding.
Proven experience taking processes from R&D through to volume production.
Strong expertise in structured problem-solving (DMAIC, 8D).
Experience with SPC, Cp/Cpk, and Design of Experiments (DoE).
Detailed knowledge of industry standards including MIL-STD-883 and IPC 600/610/7711.
Proven track record in taking processes from R&D through to volume production.The Package:
Competitive salary depending on experience.
Office hours, 37.5 hrs per week.
25 days holiday, option to purchase up to 5 days additional per year.
Employee Assistance.
Further learning or development.
Pension scheme.
Paid volunteer leave.
Parental leave
This position demands expertise in semiconductor packaging and module assembly, alongside the ability to implement and optimise scalable manufacturing systems that support a smooth progression from technology development and New Product Introduction (NPI) through to high-reliability, volume production.
Overall Purpose:
Own packaging process architecture across the full product lifecycle.
Advise leadership on packaging technology direction and capital strategy.
Lead hands-on process optimisation and problem-solving activities on the production floor.
Build scalable systems capable of supporting defence and telecom growth programmes. Key Duties:
Packaging System Architecture & Strategy.
Define and implement a structured, end-to-end packaging and assembly system aligned with our RF product roadmap.
Establish standardised process flows covering.
Die preparation: Die attach, Wire bonding, Plastic encapsulation/moulding, Dicing/singulation, QFN assembly, Inspection, reliability and SMT integration.
Technology & Concept Phase (Pre-NPI Influence).
NPI & Process Architecture Development.
Lifecycle Ownership - Concept to Volume.
Hands-on Technical Leadership.
RF & High-Frequency Packaging Integration.
Equipment, Capital & Supplier Strategy.
Governance, Compliance & Reliability.Key Requirements:
University Degree in Materials Science, Mechanical Engineering, Electronics Engineering, or related discipline, or relevant experience in semiconductor packaging and assembly processes including: QFN, Plastic encapsulation and moulding, Dicing and singulation, Die attach and wire bonding.
Proven experience taking processes from R&D through to volume production.
Strong expertise in structured problem-solving (DMAIC, 8D).
Experience with SPC, Cp/Cpk, and Design of Experiments (DoE).
Detailed knowledge of industry standards including MIL-STD-883 and IPC 600/610/7711.
Proven track record in taking processes from R&D through to volume production.The Package:
Competitive salary depending on experience.
Office hours, 37.5 hrs per week.
25 days holiday, option to purchase up to 5 days additional per year.
Employee Assistance.
Further learning or development.
Pension scheme.
Paid volunteer leave.
Parental leave