Senior Packaging Engineer
CV-LibraryKing's Cross, Greater LondonpermanentPosted: 13 July 2026
Apply NowSenior / Staff Packaging Engineer
London (Hybrid)
My client is an innovative AI hardware startup developing next-generation computing technology designed to revolutionise AI infrastructure. They're looking for an experienced Packaging Engineer to help bridge the gap between cutting-edge silicon and high-performance products, working on advanced semiconductor technologies alongside a world-class engineering team.
Role Requirements:
*
Lead the development of advanced semiconductor packaging solutions from concept through to production
*
Design and optimise package, substrate and system-level integration for high-performance devices
*
Work across package architecture, layout, simulation and product development activities
*
Collaborate with ASIC, hardware and systems engineers to deliver innovative packaging solutions
Key Skills Required:
*
Experience in semiconductor packaging or advanced electronic packaging
*
Knowledge of package, substrate or PCB design and integration
*
Experience using industry-standard package or PCB design tools
*
Understanding of signal integrity, power integrity or high-speed design principles
*
Experience working with multidisciplinary engineering teams throughout product development
If this sounds like you, please apply
London (Hybrid)
My client is an innovative AI hardware startup developing next-generation computing technology designed to revolutionise AI infrastructure. They're looking for an experienced Packaging Engineer to help bridge the gap between cutting-edge silicon and high-performance products, working on advanced semiconductor technologies alongside a world-class engineering team.
Role Requirements:
*
Lead the development of advanced semiconductor packaging solutions from concept through to production
*
Design and optimise package, substrate and system-level integration for high-performance devices
*
Work across package architecture, layout, simulation and product development activities
*
Collaborate with ASIC, hardware and systems engineers to deliver innovative packaging solutions
Key Skills Required:
*
Experience in semiconductor packaging or advanced electronic packaging
*
Knowledge of package, substrate or PCB design and integration
*
Experience using industry-standard package or PCB design tools
*
Understanding of signal integrity, power integrity or high-speed design principles
*
Experience working with multidisciplinary engineering teams throughout product development
If this sounds like you, please apply